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| W25Q64FVSSIG无铅报告 | |
| 宝星微库存：18000 PCS | |
| 厂商： WINBOND | |
| 封装： SOIC8 | |
| 年份： 2018+ | |
| 备注： 华邦原装现货 | |
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Halogen Free Compliance Report /不使用禁用物質證明書
PART NUMBER: W25Q64FVSSIG Document Date: 2015/05/19
Winbond certifies that the above part number product is in compliance with Halogen Free (IEC 61249-2-21), European RoHS (EU Directive 2011/65/EU), China RoHS, and Level 1 of SONY SS-00259 requirements.
華邦保證以上產品型號符合無鹵素(IEC 61249-2-21), 歐盟RoHS指令(指令 2011/65/EU), 中國電子資訊產品污染控制管理辦法 及 索尼SS-00259第一級管理物質之規定.
W25Q64FVSSIG已经停产（EOD),最新版本W25Q64JVSIQ,需要最新资料请联系销售代表
Banned Substance Analysis Result
Analysis reports reference
Material Pb Cd Hg CrVI PBB PBDE Br Cl Report Date
number
Mold Compound (Material I) <2 <2 <2 <2 <2 <2 <50 <50 2015/3/27 KA/2015/31311
CE/2015/38127
Mold Compound (Material II) <2 <2 <2 <2 <2 <2 <50 <50 2015/4/15 CE/2015/38129
CE/2015/38130
CE/2014/70614
Die Attached (Material I) <2 <2 <2 <2 <2 <2 <50 <50 2014/7/8 CE/2014/70611
CE/2014/70615
CE/2014/70632
Die Attached (Material II) <2 <2 <2 <2 <2 <2 <50 <50 2014/7/8 CE/2014/70629
CE/2014/70633
Die Attached (Material III) <2 <2 <2 <2 <2 <2 <50 <50 2014/10/13 CE/2014/A0235A
2015/4/27 KA/2015/40272
Leadframe <2 <2 <2 <2 <2 <2 <50 NA
2015/1/20 KA/2015/10661
Tin Plating (Material I) <13.4 <2 <2 <2 <2 <2 <50 NA 2014/8/19 KA/2014/80590
Tin Plating (Material II) <4 <2 <2 <2 <2 <2 <50 NA 2015/1/6 CANEC1421601903
Bond Wire (Material I) <2 <2 <2 <2 <2 <2 NA NA 2014/11/18 KA/2014/B0714
Bond Wire (Material II) <2 <2 <2 <2 <2 <2 NA NA 2014/10/22 CE/2014/A2568
Chip <2 <2 <2 <2 <2 <2 <50 <50 2014/10/27 CE/2014/A3352
* Unless otherwise noted, units are in PPM (parts-per-million)
* NA: Not applicable
* Third party analysis reports are available upon request through our sales representative
* 如您需要進一步分析報告, 請聯絡本公司銷售代表
European Union’s Restriction on Use of Hazardous Substances (“RoHS”)
RoHS Restricted Substances Threshold, Homogeneous Level
Cadmium (Cd) < 100 ppm
Hexavalent Chromium (CrVI) < 1000 ppm
Lead (Pb) < 1000 ppm
Mercury (Hg) < 1000 ppm
Polybrominated Biphenyls (PBBs) < 1000 ppm
Polybrominated Diphenyl Ethers (PBDEs) < 1000 ppm
Halogen Free Specifications (IEC 61249-2-21,JPCA-ES01 2003, IPC 4101)
Halogen Restricted Substances Threshold, Homogeneous Level
Chlorine (Cl) < 900 ppm
Bromine (Br) < 900 ppm
Total concentration of Bromine (Br) +Chlorine (Cl) < 1500 ppm
Signature:
Name/Title: Jing-Fong Tsai
Vice-President, Quality Assueance and ESH Center
